SERVICE TECHNIQUES & SPECIFICATIONS

Production Scale of NIL\n(2" ~ 8" wafer size)OpenClosed
  • Minimum CD in production: 25nm
  • Fragile & bowling wafers can be applied
  • Workable thickness of wafers: 75 µm ~ 2mm
E-beam Lithography\n& Photo LithographyOpenClosed
  • High-end E-beam tool for NIL mold/master fabrication
  • Process alignment mark fabrication by both of NIL and photo-litho
  • Crystalline alignment along the major flat of wafers: <0.02°
Material EtchOpenClosed
  • Dedicated dry etch tools for different materials
  • Dry etch thickness variation within wafers: ± 3nm
  • Possesses both of dry and wet etch
Nano-structure Design\n& SimulationOpenClosed
  • PWE & FDTD self-developed codes
  • Wavefront engineering designs
  • Photon block & diffracted mode simulation
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